| PART |
Description |
Maker |
| 0900590017 90059-0017 |
2.54mm (.100) Pitch C-Grid? Micro Shunt, Low Profile, White Housing
2.54mm (.100) Pitch C-Grid庐 Micro Shunt, Low Profile, White Housing
MOLEX Connector
|
Molex Electronics Ltd.
|
| 0900590014 90059-0014 |
2.54mm (.100) Pitch C-Grid? Micro Shunt, Low Profile, 4mm Gold Plating
2.54mm (.100) Pitch C-Grid庐 Micro Shunt, Low Profile, 4mm Gold Plating
MOLEX Connector
|
Molex Electronics Ltd.
|
| 0942460112 94246-0112 SD-94246-002 |
2.54mm (.100) Pitch, MOX Header, 2.54mm (.100) Grid, Through Hole, PCT, Vertical, 12 Circuit, Blue
|
Molex Electronics Ltd.
|
| 71764-0116 |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 16 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 87835-2442 0878352442 |
2.54mm (.100) Pitch C-Grid庐 Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 24 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 24 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 22-17-2142 0022172142 A-4455-BH14D |
2.54mm (.100) Pitch KK? PC Board Connector, Bottom Entry, 0.50μm (20μ) Gold (Au), 14 Circuits
2.54mm (.100) Pitch KK庐 PC Board Connector, Bottom Entry, 0.50渭m (20渭) Gold (Au), 14 Circuits
2.54mm (.100) Pitch KK垄莽 PC Board Connector, Bottom Entry, 0.50楼矛m (20楼矛) Gold (Au), 14 Circuits
|
Molex Electronics Ltd.
|
| 22-14-2074 0022142074 A-4455-BH07D |
2.54mm (.100) Pitch KK? PC Board Connector, Bottom Entry, 2.54μm (100μ) Tin (Sn), 7 Circuits
2.54mm (.100) Pitch KK庐 PC Board Connector, Bottom Entry, 2.54渭m (100渭) Tin (Sn), 7 Circuits
2.54mm (.100) Pitch KK垄莽 PC Board Connector, Bottom Entry, 2.54楼矛m (100楼矛) Tin (Sn), 7 Circuits
|
Molex Electronics Ltd.
|
| 71764-0118 |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 18 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 18 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 70247-1654 0702471654 |
2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Low Profile, Right Angle, Shrouded16 Circuits, 0.127渭m (5渭") Gold (Au) Plating, Tin(Sn) PC TailPlating
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded16 Circuits, 0.127μm (5μ) Gold (Au) Plating, Tin(Sn) PC TailPlating
|
Molex Electronics Ltd.
|
| 70247-2652 |
2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Low Profile, Right Angle, Shrouded26 Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Platin
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded26 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
Molex Electronics Ltd.
|
| 70247-1652 0702471652 |
2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Low Profile, Right Angle, Shrouded16 Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Platin
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
Molex Electronics Ltd.
|
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